Procedure
DDS Automation Pvt.ltd Repair Procedure
Workmanship
- Each board is repaired to meet or exceed OEM specifications
- We maintain the Lead-free Integrity of each component
- Visually inspect fine-point components.
- Use the same components or exact replacements as OEM
- All units are air blown to remove dust and debris and inspected for corrosion, rust, damaged traces.
- Oil, dirt, and lint build up is removed with a PCC cleaner.
- Components identified as damaged are carefully removed and replaced with new, unused components.
- Surface mount components are carefully handled with tools that allow for safe removal and re-soldering of components without damaging traces or nearby components.
- Solder joints repaired by hand are indistinguishable from original joints.
- Damaged traces, pads and through-hole connections are repaired.
Functional Testing
- Each board tested in a full rack specific to that system
- CPU modules are installed in the appropriate backplane, programmed with a test program that tests all aspects of the CPU performance.
- All programming and communications ports are tested for communications with external devices
- Test each I/O circuit under load conditions
- Each point on an input or output module is tied to an appropriate device and cycled on and off
- Each power supply unit is installed in a fully loaded backplane and powered up to verify that the appropriate voltages and currents are provided to the backplane
- Each I/O slot is loaded with an input module and then an output module to verify proper bi-directional communication to the CPU
- Firmware on CPUs and Intelligent modules is upgraded to latest revision, or any revision request